Tao Xu, Hal Amick and Michael Gendreau
The semiconductor industry is experiencing the transition from 200mm to 300mm fabs. With a number of 300mm fabs now on-line, and many more in the
construction and start-up stages, a discussion of 300mm fab design is
pertinent. Vibration is an important concern in fab design and construction
because many items of precision equipment (or “tools”) in a fab have
environmental requirements that must be met in order to perform
satisfactorily; in many cases these requirements include limits placed on
vibrations.
The transition from 200mm to 300mm fabs poses a significant challenge for fab
vibration design because of the increase in wafer diameter, more advanced
tools, more sophisticated process technology, and increased automation. More
than ever, a multi-discipline approach to vibration control is called for in
fab development.
This paper presents an integrated vibration design process for a 300mm fab.
Presented at SEMI Technology Symposium (STS), March 12-14, 2003, SEMICON China
2003, Shanghai, China